IT House news on August 6th, according to today's news from the official public account of Boway Alloys, in order to help the development of the thermal management industry, the 5G Thermal Management Industry Summit Forum will be held tomorrow in Longgang, Shenzhen.The conference will cover topics such as water cooling, two-phase liquid cooling, loop heat pipes, high thermal conductivity materials, ultra-thin VCs, etc.
Boway Alloys said that 5G technology promotes a new round of market reshuffle, and 5G equipment has become a key point for leading companies to compete for control.In order to ensure the reliable operation of 5G equipment, reducing equipment power consumption, reducing equipment heat generation, and improving equipment heat dissipation capacity have become the top priority.Therefore, many companies have invested in the research and development of new and efficient thermal management technologies and products.
According to the introduction of Boway Alloy, it will give a keynote speech on "Application of High Performance Copper Alloy in Thermal Management" at the conference.The speech will introduce the promotion of 5G commercial popularization on cooling technology and products, and the role of liquid cooling represented by vapor chambers in 5G mobile phones.
It is worth mentioning that this meeting will include vivo thermal design director/engineer, Xiaomi thermal design engineer, Huawei thermal design engineer, ZTE material technology quality engineer, Honor thermal design engineer, etc.Guests participated, This means that Huawei, Xiaomi, vivo, Honor, etc. will jointly discuss the development of 5G thermal management industry.
IT Home understands that the Snapdragon 888 processor and the Snapdragon 8 Gen 1 processor released by Qualcomm in the past two years have deteriorated in thermal management, which has led many mobile phone manufacturers to vigorously develop heat dissipationtechnology.For example, OnePlus claims that the OnePlus Ace Pro will feature the industry's first eight-channel full-through VC, doubling its thermal conductivity.Motorola said that the moto X30 Pro will use the steam runway cooling technology, and the total cooling area of the machine is nearly 20000mm².